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US 2002/0118511 A1Published application
Heat dissipation device
OwnerPrateek J. Dujari, Terrance J. Dishongh +2inventors
InventorsPrateek J. Dujari, Terrance J. Dishongh, Bin Lian, Damion T. Searls
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Abstract
A heat dissipation device comprising a base portion, having a chamber defined therein, and a plurality of projections extending from the base portion. At least one projection of the plurality of projections also has a chamber defined therein that is in fluid communication with the base portion chamber to form a vapor chamber of a heat pipe.
Claims20
A heat dissipation device, comprising:
- a base portion having at least one chamber defined therein;
- a plurality of projections extending from said base portion, at least one of said plurality of projections having at least one chamber defined therein;
- and
- said base portion chamber and said at least one projection chamber adapted to be in fluid communication with one another to form a vapor chamber.
1 more element
A microelectronic assembly, comprising:
- a microelectronic die having a back surface;
- and
- a heat dissipation device attached to said microelectronic die back surface, comprising:
- a base portion having at least one chamber defined therein;
- a plurality of projections extending from said base portion, at least one of said plurality of projections having a chamber defined therein;
- and
- said base portion chamber and said at least one projection chamber adapted to be in fluid communication with one another to form a vapor chamber.
4 more elements
A method of forming a heat dissipation device, comprising:
- forming a heat dissipation device base portion having at least one chamber defined therein;
- forming a plurality of projections extending from said base portion;
- drilling a hole in at least one of said plurality of projections, wherein said hole extends from a first surface to said at least one base portion chamber;
- and
- capping said hole proximate said projection first surface.
2 more elements
A method of forming a heat dissipation device, comprising:
- forming a heat dissipation device base portion having at least one recess defined therein;
- forming a plurality of folded-fin projections;
- attaching said folded-fin projections to said base portion;
- and
- sealing said folded-fin projections to form a vapor chamber from said base portion recess and said sealed folded-fin projections.
2 more elements
Dependencies are inferred from the claim text.