Power supply module

A power supply module for high output currents, particularly a DC-DC converter, with

• a plate shaped carrier element (10) configured to interact with a planar inductor and having a plurality of conductor layers, which has a suitably shaped opening (12) to receive a core element of the planar inductor, on the component side is formed for automated mounting of electronic components (16), particularly a power semiconductor (14), and
• on the output side has a contact arrangement (40) to discharge the high output current,
• and wherein the carrier element is formed to interact with a plate-shaped cooling element (26) such that the cooling element realizes cooling of the core element of the planar inductor as well as an electronic component provided on the component side,
• characterized in that
• the cooling element on its side facing the carrier element in its assembled state has at least one trough-shaped indentation (28, 30, 32) integrally incorporated or formed in the cooling element material, which simulates a component side surface contour of the carrier element with mounted electronic components and permits selective potting in the region of the trough-shaped indentation with a heat-conducting potting compound.

A power supply module for high output currents, particularly a DC-DC converter, with

• a plate-shaped carrier element (10) configured to interact with a planar inductor and having a plurality of conductor layers, which has a suitably formed opening (12) to receive a core element of the planar inductor, on the component side is formed for automated mounting of electronic components (16), particularly a power semiconductor (14), and
• on the output side has a contact arrangement (40) to discharge the high output current,
• characterized in that
• the contact arrangement has an integrally formed fork-shaped connector element (40), which at one end has a plurality of finger segments (46) connected by a bridge segment (48) to interact with a downstream consumer unit, and at the other end has a flange segment (42), which fits against the bridge segment and is formed for automated soldering of the connector element to the carrier element by reflow soldering.