Interconnected printhead die and carrier substrate system

An interconnected printhead die and carrier substrate system for a printhead in hard-copy-producing devices used to print on print media, comprising:

• a printhead die having an operative face separated from an inner face, and including integrated circuits formed therein;
• a carrier substrate having an operative face and an inner face, being coupled to the die, and including integrated circuits formed therein;
• and
• an electrical-connection region located adjacent the inner faces of the die and substrate, effective to accommodate bilateral communication between integrated circuits formed on the die and the substrate.

A method of coupling a printhead die and a carrier substrate for use in a printhead of hard-copy-producing devices used to print on print media, comprising:

• choosing at least three spacers to position between selected regions of the die and substrate to define a space;
• positioning the spacers between the selected regions of the die and substrate;
• adhering the spacers to the die and substrate using a first curable adhesive;
• after curing the first adhesive;
• adding a second curable adhesive to fill the space.