Millimeterwave module compact interconnect
AssigneeLockheed Martin Corporation
InventorAlbert Pergande
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Abstract
The present invention is generally directed to an interconnect structure, which in accordance with exemplary embodiments, includes a first layer and a second layer for connecting an integral first signal path with a second signal path. The first layer can have a first conductor and a slot. The second layer can be positioned to be in operable communication by an opening between the first layer and the second signal path such that a distance from the first signal path to a second surface of the second layer establishes an evanescent mode of signal propagation.
Claims21
An interconnect structure connecting an integral first signal path with a second signal path, the interconnect structure comprising:
- a first layer, having a first conductor and having a slot on a first surface;
- and
- a second layer, having a first surface in operable communication with the first surface of the first layer, a second surface for communicating with a second signal path, an opening for signal propagation between the first signal path and the second signal path, wherein a distance from the first signal path to the second surface of the second layer establishes an evanescent mode of signal propagation.
A method of connecting a signal path comprising:
- positioning a first layer with a first conductor and a slot on a first surface, wherein a signal carried on the first conductor induces a plurality of field lines;
- positioning a second layer abutting the first surface of the first layer, the second layer having a first surface in operable communication with the first surface of the first layer, a second surface for communicating with a second signal path, an opening for signal propagation between the first signal path and the second signal path;
- and
- positioning the second signal path abutting the second surface of the second layer, wherein a signal carried on the second signal path induces a plurality of field lines, the second signal path having a plurality of field lines, the plurality of field lines of the second signal path are aligned with the plurality of field lines of the first conductor.
Dependencies are inferred from the claim text.