Wafer probe station

A method for inspecting a device under test in a probe station, the method comprising:

• providing a chuck apparatus for supporting the device under test, the chuck apparatus comprising:
• a laterally extending insulator having an upper surface,
• a first conductive element disposed on said upper surface of said insulator adapted for electrical contact with said device under test,
• a laterally extending second conductive element disposed belong said insulator,
• a laterally extending third conductive element disposed below and electrically isolated from said second conductive element and having a portion at its periphery extending vertically opposite the sides of said second conductive element and
• a fourth conductive element disposed on said insulator, said fourth conductive element laterally surrounding and electrically isolated from said first conductive element;
• applying an electric potential to said first conductive element and to at least one of said second, third and fourth conductive elements.

A method of manufacturing a chuck apparatus for a wafer probe station, the method comprising:

• depositing a first amount of conductive material on an insulator plate comprising an electrical insulator material to form a conductive test area;
• depositing a second amount of conductive material on the insulator plate spaced from and laterally surrounding the conductive test area to form an electrically isolated conductive element,
• supporting said insulator plate on a conductive support,
• attaching and electrically isolating a further conductor spaced below, said conductive support, and
• adapting the conductive test area, isolated conductive element, conductive support, and further conductor for being coupled to electrical potentials.

A probe station for inspecting a device under test comprising:

• a frame having, opposite vertically disposed supports,
• a horizontally extending platen supported on said frame
• a chuck apparatus for supporting the device under test positioned as within said frame, and
• a holder supported on said platen for holding a probe for contacting said device under test,
• said chuck apparatus further comprising:
• a laterally extending electrical insulator having an upper surface;
• a first conductive member disposed on the upper surface of said insulator for supporting a wafer device under test, said insulator supported on a second conductive member, the outer edge of the first conductive member being spaced from the outer edge of the insulator;
• a third conductive member isolated from and spaced below said second conductive member;
• and
• an electrically isolated fourth conductive member disposed on the upper surface of said insulator in spaced relation to the outer edge of said first conductive member.

A chuck apparatus for a wafer probe station, comprising:

• a laterally extending electrical insulator having an upper surface;
• a first conductive member disposed on the upper surface of said insulator for supporting a wafer device under test;
• said insulator supported on a second conductive member;
• and
• a third conductive member isolated from said second conductive member and having a laterally extending portion spaced below said second conductive element and a vertically extending sidewall terminating opposite said second conductive member.