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AssigneeVentra Greenwich Holdings Corp.
InventorsBrian J. Malone, Todd M. Nykerk, Timothy J. Kelly
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The invention relates to a method for vacuum deposition of circuitry onto a thermoplastic material. In one of its aspects, the invention relates to a vacuum deposition of circuitry for automotive applications. In another of its aspects, the invention relates to a vehicular lamp housing incorporating a circuit placed thereon by vacuum deposition. In another of its aspects, the invention relates to a vehicular lamp housing with vacuum deposition of circuitry powering light-emitting diodes. In another of its aspects, the invention relates to a vehicular lamp housing with a vacuum deposition of circuitry powering removable incandescent lamps.
A method of manufacturing a conductive lamp housing, comprising depositing a layer of conductive material on a substrate that forms part of the lamp housing, in order to form part of one or more electrical circuits when said conductive material is connected to at least one or more power sources and one or more light sources.
The method of manufacturing a lamp housing of claim 2, wherein the deposition of the layer of conductive material is deposited by vacuum deposition.
The method of manufacturing a lamp housing of claim 1 or 11, wherein the layer of conductive material is metal.
The method of manufacturing a lamp housing of claim` 1 or 11, wherein the layer of conductive material is deposited by direct metallization of the conductive material onto the substrate.
A lamp housing comprising a substrate, further comprising a conductive layer for one or more electrical circuits deposited on said substrate.
Dependencies are inferred from the claim text.