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US 2002/0117766 A1Published application
Method of manufacturing solid state image pick up device having microlenses
AssigneeSamsung Electronics Co., Ltd.
InventorSang-sik Kim
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Abstract
A method of manufacturing a solid state image pick up device, which is capable of increasing the hardness of a microlens is provided. A plurality of photosensing device arrays are formed on a semiconductor substrate. Next, a plurality of microlenses are formed on the semiconductor substrate on which the photosensing device arrays are formed. Next, the surfaces of the microlenses are hardened by irradiating light into the microlenses.
Claims22
A method of manufacturing a solid state image pick up device having microlenses, comprising:
- forming a plurality of photosensing device arrays on a semiconductor substrate;
- forming a plurality of microlenses on the semiconductor substrate on which the photosensing device arrays are formed;
- and
- hardening the surfaces of the microlenses by irradiating light into the microlenses.
1 more element
A method of manufacturing a solid state image pick up device having microlenses, comprising:
- forming a plurality of photosensing device arrays on a semiconductor substrate;
- forming a plurality of microlenses on the semiconductor substrate on which the photosensing device arrays are formed;
- and
- hardening the surfaces of the microlenses by irradiating DUV rays into the microlenses;
- wherein the DUV rays are irradiated into the microlenses until the pencil hardness of the microlenses reaches 7-10.
2 more elements
Dependencies are inferred from the claim text.