Lead-on-chip type of semiconductor package with embedded heat sink

Abstract

A lead-on-chip (LOC) type of semiconductor package is proposed, which is characterized by the provision of an embedded heat sink in the encapsulation body and thermally coupled to the packaged semiconductor chip. The proposed semiconductor package is constructed on a leadframe including an outer-lead portion, an inner-lead portion, and a downset bond-finger portion. During packaging process, a semiconductor chip is arranged on the back side of the inner-lead portion of the leadframe and whose active surface is attached to the downset bond-finger portion of the leadframe; then, a plurality of bonding wires are bonded between the respective I/O pads of the semiconductor chip and the downset bond-finger portion of the leadframe. Further, a heat sink is adhered to the front side of the inner-lead portion of the leadframe by means of an electrically-insulative and thermally-conductive adhesive material. Finally, an encapsulation body is formed to encapsulate the semiconductor chip, the inner-lead portion of the leadframe, the bonding wires, and the heat sink. Owing to the embedded heat sink configuration, it allows the packaged semiconductor chip to have good heat-dissipation efficiency during operation and also allows the overall package body to be made very compact in size.

Dependencies are inferred from the claim text.