Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device
AssigneeMicron Technology, Inc.
InventorRichard W. Wensel
Life of this patent
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Abstract
An encapsulant molding technique used in chip-on-board encapsulation wherein an oxidizable metal layer is patterned on a substrate and the oxidizable metal layer is oxidized to facilitate removal of unwanted encapsulant material. The oxidizable metal layer which adheres to the substrate is applied over a specific portion of the substrate. The oxidizable metal layer is oxidized to form a metal oxide layer which does not adhere to encapsulant materials.
Claims20
A semiconductor device assembly for facilitating removal of unwanted encapsulant material formed in an encapsulant channel when filling an encapsulant mold connected to the encapsulant channel, the assembly comprising:
- a carrier substrate having at least one die attach site;
- at least one semiconductor device attached to said at least one die attach site of said carrier substrate;
- and
- an oxide-surfaced path formed directly on said carrier substrate, said oxide-surfaced path extending from a first portion of said carrier substrate proximate said at least one die attach site to a second portion on said carrier substrate, wherein said oxide-surfaced path is sized and configured to substantially extend and correspond to an extent of the encapsulant channel of the encapsulant mold.
A carrier assembly for facilitating removal of unwanted encapsulant material formed from an encapsulant mold, the carrier assembly comprising:
- a carrier substrate having at least one die attach site;
- at least one semiconductor device attached to said at least one die attach site of said carrier substrate;
- and
- an oxide-surfaced path formed directly on said carrier substrate, said oxide-surfaced path extending from a first portion on said carrier substrate proximate said at least one die attach site to a second portion on said carrier substrate, wherein said oxide-surfaced path is configured to substantially extend and correspond to an extent of an encapsulant channel of the encapsulant mold.
A chip-on-board assembly comprising:
- a substrate having at least one die attach site;
- at least one semiconductor device attached to said at least one die attach site;
- an encapsulant material encapsulating said at least one semiconductor device;
- and
- an oxide-surfaced path formed directly on said substrate, said oxide-surfaced path extending from a first portion on said substrate proximate a periphery of said encapsulant material encapsulating said at least one semiconductor device to a second portion on said substrate.
Dependencies are inferred from the claim text.