Semiconductor device and method for manufacturing semiconductor device
AssigneeSanyo Electric Co., Ltd.
InventorTomio Yamashita
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Abstract
A method for manufacturing a semiconductor device having flat pads. An opening and island-like dielectric films are first formed in a dielectric film. The opening is then filled with metal, and a metal layer is formed on the dielectric film. The upper surface of the metal layer is flattened using the CMP technique with the upper surface of the dielectric film functioning as a stopper. The island-like dielectric films prevent the occurrence of dishing in a conductive portion.
Claims11
A semiconductor device comprising:
- a semiconductor substrate;
- at least one dielectric film arranged on the substrate and having an opening;
- a conductive portion filling the opening;
- and
- at least one dielectric member embedded in the conductive portion that fills the opening.
A method for manufacturing a semiconductor device comprising:
- forming an opening in a dielectric film arranged above the semiconductor substrate so as to leave a dielectric projection in the opening;
- filling the opening with a metal;
- and
- flattening the surface of the metal using the upper surface of the dielectric film as a stopper.
A semiconductor device comprising:
- a semiconductor substrate;
- at least one dielectric film arranged on the substrate and including an upper surface, a lower surface, and an opening;
- at least one dielectric member arranged in the opening;
- and
- a conductive portion filling the opening so as to surround the at least one dielectric member.
A method for manufacturing a semiconductor device comprising:
- forming a dielectric film arranged above a semiconductor substrate;
- forming an opening in the dielectric film so as to leave a dielectric projection in the opening by removing part of the dielectric film;
- filling the opening with a metal;
- and
- flattening the metal so that the upper surface of the dielectric film is flush with the upper surface of the metal.
Dependencies are inferred from the claim text.