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US 2002/0117753 A1Published application
Three dimensional packaging
OwnerMichael G. Lee, Wen-chou Vincent Wanginventors
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Abstract
A method for forming a multilayer circuit substrate is disclosed. Preferably, a multilayer circuit substrate precursor is formed using a build up process. The multilayer circuit substrate precursor comprises an internal conductive post, an internal conductive layer coupled to one end of the conductive post, and an dielectric layer disposed around the conductive post. The multilayer circuit substrate precursor and the conductive post are cut to form a side electrical contact structure from the cut post.
Claims21
A method comprising:
- forming a multilayer circuit substrate precursor using a build up process, wherein the multilayer circuit substrate precursor comprises an internal conductive post, an internal conductive layer coupled to one end of the conductive post, and an dielectric layer disposed around the conductive post;
- and
- cutting the multilayer circuit substrate precursor and the conductive post to form a side electrical contact structure from the cut post.
An electrical assembly comprising:
- a conductive body;
- a first multilayer circuit substrate having opposing sides, and a side electrical contact structure disposed between the opposing sides of the first multilayer circuit structure;
- and
- a second multilayer circuit substrate, wherein the conductive body is disposed on the side electrical contact structure and the first and second circuit substrates are coupled to each other via the conductive body.
1 more element
A multilayer circuit substrate comprising:
- a first planar surface and a second planar surface wherein the first and second planar surfaces are opposite to each other;
- a side electrical contact structure disposed between the first and second surfaces;
- a conductive layer between the first and second surfaces wherein the conductive layer is electrically coupled to the side electrical contact structure and is internal to the multilayer circuit substrate;
- and
- a dielectric layer.
2 more elements
Dependencies are inferred from the claim text.