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US 2002/0117744 A1Published application
Stitched plane structure and process for package power delivery and dual referenced stripline I/O performance
AssigneeIntel Corporation
InventorsDustin Wood, Seng Hooi Ong, Edward A. Burton
Life of this patent
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Abstract
Conductive planes in a power delivery region of a microelectronic package substrate are stitched to correlated conductive planes in a signal region of the substrate. The conductive planes occupy varying horizontal levels of the substrate and are stitched together at a junction between the power delivery region and the signal region of the substrate using alternating tabs connected with vias.
Claims28
A microelectronic package, comprising:
- a die affixed to a substrate including a plurality of conductive planes;
- and
- conductive planes in a power delivery region of the substrate connected to correlated conductive planes in a signal region of the substrate, the connected conductive planes occupying varying horizontal planes of the substrate.
A microelectronic package, comprising:
- a die affixed to a substrate including a plurality of conductive planes;
- a power delivery region of the substrate merging with a signal region of the substrate at a junction;
- and
- alternating tabs in the power delivery region of the substrate stitched together at the junction with alternating tabs in the signal region of the substrate, the alternating tabs corresponding to conductive planes occupying varying horizontal planes of the substrate.
1 more element
A process for fabricating a microelectronic package, the process comprising:
- providing a die affixed to a substrate including a power delivery region and a signal region;
- and
- stitching conductive planes in the power delivery region of the substrate to correlated conductive planes in a signal region of the substrate, the stitched conductive planes occupying varying horizontal planes of the substrate.
A multilayer microelectronic package substrate, comprising:
- a power plane on one level in a power delivery region of the substrate electrically coupled to a power plane on another level in the signal region of the substrate;
- and
- a ground plane on one level in a power delivery region of the substrate electrically coupled to a ground plane on another level in the signal region of the substrate.
Dependencies are inferred from the claim text.