Wiring board and semiconductor device using the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorTakayuki Yoshida
Life of this patent
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Abstract
A wiring board according to the present invention has a substrate, a plurality of lines provided on the substrate, an interference-preventive conductor layer provided between the lines to have open ends and prevent signal interference between the lines, and a via electrically connected to the interference-preventive conductor layer. The via is provided at a point at which a distance from each of the open ends of the interference-preventive conductor layer is less than one quarter of a wavelength corresponding to a maximum frequency component of harmonic components contained in the signal.
Claims4
A wiring board comprising:
- a substrate;
- a plurality of lines provided on the substrate;
- an interference-preventive conductor layer provided between the lines to have open ends and prevent signal interference between the lines;
- and
- potential fixing means electrically connected to the interference-preventive conductor layer,
- the potential fixing means being provided at a point at which a distance from each of the open ends of the interference-preventive conductor layer is less than one quarter of a wavelength corresponding to a maximum frequency component of harmonic components contained in the signal.
A semiconductor device comprising:
- a substrate;
- a plurality of lines provided on the substrate;
- a semiconductor chip held on the substrate, the semiconductor chip having a semiconductor element electrically connected to the plurality of lines;
- an interference-preventive conductor layer provided between the lines to have open ends and prevent signal interference between the lines;
- and
- potential fixing means electrically connected to the interference-preventive conductor layer,
- the potential fixing means being provided at a point at which a distance from each of the open ends of the interference-preventive conductor layer is less than one quarter of a wavelength corresponding to a maximum frequency component of harmonic components contained in the signal.
Dependencies are inferred from the claim text.