Solder, method for processing surface of printed wiring board, and method for mounting electronic part
AssigneeNEC Corporation
InventorsToshihide Ito, Shiro Hara
Life of this patent
Estimating the term…
Abstract
A solder consists essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, and the remaining of Sn and inevitable impurities.
Claims24
A solder consisting essentially of:
- 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, and the remaining of Sn and inevitable impurities.
A solder consisting essentially of:
- 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, 0.02% to 0.06% of Ni by mass, and the remaining of Sn and inevitable impurities.
A solder consisting essentially of:
- 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, 0.02% to 0.06% of Fe by mass, and the remaining of Sn and inevitable impurities.
A solder consisting essentially of:
- 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, 0.02% to 0.06% of Ni by mass, 0.02% to 0.06% of Fe by mass, and the remaining of Sn and inevitable impurities.
A method for processing a surface of a printed wiring board comprising the step of:
- coating a circuit formed on a surface of a printed wiring board with a solder consisting essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, and the remaining of Sn and inevitable impurities.
A method for processing a surface of a printed wiring board comprising the step of:
- coating a circuit formed on a surface of a printed wiring board with a solder consisting essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, 0.02% to 0.06% of Ni by mass, and the remaining of Sn and inevitable impurities.
A method for processing a surface of a printed wiring board comprising the step of:
- coating a circuit formed on a surface of a printed wiring board with a solder consisting essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, 0.02% to 0.06% of Fe by mass, and the remaining of Sn and inevitable impurities.
A method for processing a surface of a printed wiring board comprising the step of:
- coating a circuit formed on a surface of a printed wiring board with a solder consisting essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, 0.02% to 0.06% of Ni by mass, 0.02% to 0.06% of Fe by mass, and the remaining of Sn and inevitable impurities.
A method for mounting an electronic part comprising the step of:
- soldering an electronic part on a circuit formed on a surface of a printed wiring board with a solder consisting essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, and the remaining of Sn and inevitable impurities.
A method for mounting an electronic part comprising the step of:
- soldering an electronic part on a circuit formed on a surface of a printed wiring board with a solder consisting essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, 0.02% to 0.06% of Ni by mass, and the remaining of Sn and inevitable impurities.
A method for mounting an electronic part comprising the step of:
- soldering an electronic part on a circuit formed on a surface of a printed wiring board with a solder consisting essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, 0.02% to 0.06% of Fe by mass, and the remaining of Sn and inevitable impurities.
A method for mounting an electronic part comprising the step of:
- soldering an electronic part on a circuit formed on a surface of a printed wiring board with a solder consisting essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, 0.02% to 0.06% of Ni by mass, 0.02% to 0.06% of Fe by mass, and the remaining of Sn and inevitable impurities.
Dependencies are inferred from the claim text.