Rework and underfill nozzle for electronic components
AssigneeInternational Business Machines Corporation
InventorsWilton L. Cox, Joseph D. Poole, Kris A. Slesinger
Life of this patent
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Abstract
Method and apparatus for desoldering electronic compo from a substrate. A vacuum is used, to enhance the f a hot gas under an electronic component to reflo solder connections attaching the electronic compo o a substrate. Water vapor is added to the hot gas t ease the heat capacity of the hot gas. A system for p cally changing the direction of flow of the hot gas a uum under the electronic component is used to unifo eat the solder connections. od and apparatus for depositing underfill mater tween an electronic component and the substrate on wh e electronic component is mounted. A vacuum is appli enhance the flow of underfill material into the space an the electronic component and the substrate.
Claims43
A rework nozzle apparatus, comprising:
- a system for directing a flow of hot gas under an electronic component to reflow solder connections attaching the electronic component to a substrate;
- a system for generating a vacuum under the electronic component;
- and
- a system for injecting a substance into the hot gas to increase a heat capacity of the hot gas.
A rework nozzle apparatus, comprising:
- a system for directing a flow of hot material under an electronic component in a first direction to reflow solder connections attaching the electronic component to a substrate;
- and
- a system for periodically changing the direction of flow of the hot material under the electronic component.
low method, comprising the steps of:
- directing a flow of a hot gas under an electronic component to reflow solder connections attaching the electronic component to a substrate;
- and
- injecting a substance into the hot gas to increase a heat capacity of the hot gas.
A reflow method, comprising the steps of:
- directing a flow of a hot material under an electronic component to reflow solder connections attaching the electronic component to a substrate;
- and
- periodically changing a direction of flow of the hot material under the electronic component to provide a substantially uniform reflow of the solder connections.
An apparatus for inserting underfill material into a space between an electronic component and a substrate, comprising:
- a quantity of underfill material deposited along all but one side of the electronic component;
- a tube having a first end in contact with the substrate and a second end coupled to a vacuum source, the tube including a side opening in engagement with the one side of the electronic component, wherein a vacuum generated within the tube causes the underfill material to flow into the space between the electronic component and the substrate.
A method for inserting underfill material into a space between an electronic component and a substrate, comprising the steps of:
- depositing a quantity of underfill material along all but one side of the electronic component;
- and
- generating a vacuum at the one side of the electronic component to draw the underfill material into the space between the electronic component and the substrate.
An apparatus for inserting underfill material into a space between an electronic component and a substrate, comprising:
- a quantity of underfill material deposited along the sides of the electronic component;
- a through hole in the substrate beneath the electronic component;
- and
- a system for applying a vacuum to the through hole to draw the underfill material into the space between the electronic component and the substrate.
A method for inserting underfill material into a space between an electronic component and a substrate, comprising:
- depositing a quantity of underfill material along the sides of the electronic component;
- providing a through hole in the substrate beneath the electronic component;
- and
- applying a vacuum to the through hole to draw the underfill material into the space between the electronic component and the substrate.
An apparatus for inserting underfill material into a space between an electronic component and a substrate, comprising:
- a tube for enclosing the electronic component, the tube including a first end in contact with the substrate;
- a through hole in the substrate beneath the electronic component;
- a system for injecting underfill material via the through hole into the space between the electronic component and the substrate;
- and
- a system for applying a vacuum to the tube to draw underflow material into the space between the electronic component and the substrate.
A method for inserting underfill material into a space between an electronic component and a substrate, comprising:
- enclosing the electronic component within a housing;
- providing a through hole in the substrate beneath the electronic component;
- injecting underfill material via the through hole into the space between the electronic component and the substrate;
- and
- applying a vacuum to the housing to draw underflow material into the space between the electronic component and the substrate.
An apparatus for inserting underfill material into a space between an electronic component and a substrate, comprising:
- an underfill tube having a first end in contact with the substrate and a second end coupled to an underfill source, the tube including a side opening in engagement with a first side of the electronic component;
- and
- a vacuum tube having a first end in contact with the substrate and a second end coupled to a vacuum source, the tube including a side opening in engagement with a second side of the electronic component;
- wherein a vacuum generated within the vacuum tube causes underfill material to flow from the underfill tube into the space between the electronic component and the substrate.
Dependencies are inferred from the claim text.