Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip

A semiconductor device comprising:

• a first semiconductor chip in which a through portion penetrating through a surface and a reverse surface of the semiconductor chip is formed in a scribe line region in the vicinity of an active region where a functional device is formed, and a conductive member is arranged in the through portion, the reverse surface being a surface opposite to the surface on the side of an active surface layer region;
• and
• a solid device having a connecting portion joined to the conductive member on the reverse surface of the first semiconductor chip.

A semiconductor device having a plurality of semiconductor chips in stacked relation, wherein

• at least a lowermost semiconductor chip out of the plurality of semiconductor chips has a through portion penetrating through a surface and a reverse surface of the lowermost semiconductor chip formed in a scribe line region in the vicinity of an active region where a functional device is formed, and a conductive member arranged in the through portion.

A method of fabricating a semiconductor chip by cutting a semiconductor substrate along a scribe line, comprising the steps of:

• forming a through hole penetrating through a surface and a reverse surface of the semiconductor substrate in a scribe line region that is a region in the vicinity of the scribe line on the semiconductor substrate;
• and
• arranging a conductive member in the through hole.