Methods and apparatus for making integrated circuit package including opening exposing portion of the IC

A method for making an integrated circuit (IC) package with an exposed portion of the IC, the method comprising:

• providing a mold including first and second mold portions, the first mold portion carrying a mold protrusion defining an IC-contact surface;
• closing the first and second mold portions around the IC to downset the IC under controlled pressure applied by the IC-contact surface to the IC;
• injecting encapsulating material into the mold to make the IC package with the exposed portion adjacent the mold protrusion;
• and
• releasing the IC package from the mold.

A method making an integrated circuit (IC) package with an exposed portion of the IC, the method comprising:

• providing a mold including first and second mold portions, the first mold portion carrying a mold protrusion defining an IC-contact surface;
• mounting the IC on a lead frame having a die pad with an opening therein;
• closing the first and second mold portions around the IC and leadframe;
• injecting encapsulating material into the mold at an elevated temperature to make the IC package with the exposed portion adjacent the mold protrusion;
• and
• releasing the IC package from the mold.

A method for making an integrated circuit (IC) package with an exposed portion of the IC, the method comprising:

• providing a mold including first and second mold portions, the first mold portion carrying a mold protrusion defining an IC-contact surface;
• mounting the IC on a substrate so that the substrate covers a back surface of the IC opposite the exposed portion;
• closing the first and second mold portions around the IC and substrate and injecting encapsulating material into the mold to form the IC package with the exposed portion adjacent the mold protrusion and with the substrate preventing the encapsulating material from extending onto the back surface of the IC;
• and
• releasing the IC package from the mold.