Method of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip and packages formed thereby
AssigneeMicron Technology, Inc.
InventorSalman Akram
Life of this patent
Estimating the term…
Abstract
Methods for forming substantially chip scale packages and the resulting structures. The methods comprise applying an adhesive on an active surface of a semiconductor chip to form a patterned adhesive layer on a portion of the active surface. A leadframe having leads with inner lead ends and outer lead ends is provided. The inner lead ends of the leads are aligned proximate to the adhesive-free area and the leads are attached to the adhesive layer on the active surface of the semiconductor chip. The outer lead ends are oriented to form a footprint which is not substantially larger than the dimensions of the semiconductor chip.
Claims20
A method for packaging a semiconductor chip having a back surface, an active surface opposing the back surface and having predetermined boundaries, and having bond pads on the active surface, the method comprising:
- providing a tape automated bonding tape exhibiting leads, the leads each having a top surface, a bottom surface, an inner end, and an outer end;
- aligning the inner ends of the leads proximate to the bond pads and attaching the bonding tape to the active surface of the semiconductor chip;
- bonding the inner ends of the leads to the bond pads of the semiconductor chip;
- forming a cap having lateral outer boundaries;
- aligning the cap over the bond pads and leads with the outer lead ends extending beyond the at least one outer lateral bonding of cap;
- and
- bonding the cap over the leads.
A method for packaging a semiconductor chip having a back surface, an active surface opposing the back surface and having predetermined boundaries, and having bond pads on the active surface, the method comprising:
- providing a tape automated bonding tape exhibiting leads, the leads each having a top surface, a bottom surface, an inner end, and an outer end;
- aligning the inner ends of the leads proximate to the bond pads and attaching the bonding tape to the active surface of the semiconductor chip;
- bonding the inner ends of the leads to the bond pads of the semiconductor chip;
- forming a cap having a footprint substantially coextensive with the predetermined boundaries of the semiconductor chip;
- aligning the cap over the bond pads and leads with the outer lead ends extending beyond the at least one outer lateral bonding of cap;
- and
- bonding the cap over the leads.
Dependencies are inferred from the claim text.