Circuit unit and method of producing same
AssigneeYazaki Corporation
InventorsYasuyoshi Serizawa, Kenji Iwasaki, Minoru Kubota, Keizo Nishitani
Life of this patent
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Abstract
An upper surface of a bottom surface (31) of a lower casing (30), covering a lower surface of an FPC (23), is made flat so as not to hinder a coating operation in which solder paste is coated to the upper surface of the FPC (23) by a squeegee. This lower casing is made of a heat-resistant insulative material, and the lower casing is charged into a solder reflow furnace, with electronic parts (25) attached to the FPC (23).
Claims6
A circuit unit comprising:
- a flexible printed circuit including a wiring circuit formed on an insulative substrate thereof, an electronic part being mounted on an upper surface thereof;
- a lower casing for holding the flexible printed circuit, including a flat bottom wall for covering a lower surface of the flexible printed circuit, wherein the lower casing is made of a heat-resistant material so that the lower casing can be sent to a solder reflow furnace in a state that the electric parts is mounted on the flexible printed circuit;
- and
- a upper casing, for covering the flexible printed circuit, including an engagement member through which the upper casing is connected to the lower casing.
A method of manufacturing a circuit unit comprising a flexible printed circuit, a lower casing for holding the flexible printed circuit, and an upper casing, for covering the flexible printed circuit, connectable to the lower casing, the method comprising the steps of:
- putting and fixing the flexible printed circuit on a predetermined flat position of the lower casing;
- mounting an electric part on the flexible printed circuit;
- sending the lower casing, mounting the flexible printed circuit with the electric part, to a solder reflow furnace so that the electric part is soldered to the flexible printed cable;
- and
- connecting the upper casing to the lower casing.
Dependencies are inferred from the claim text.