Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate
AssigneeINCEP Technologies, Inc.
InventorsJoseph T. Dibene II, David H. Hartke
Life of this patent
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Abstract
A stack up assembly for supplying power and removing heat from a microprocessor while controlling electromagnetic emissions is disclosed. The stack up assembly comprises a VRM circuit board or power regulation module, having a first side and a second side; a thermally conductive plate such as a vapor plate having a first side and a second side, wherein the thermally conductive plate first side is thermally coupled to the second side of the VRM circuit board; and a microprocessor having a first side and a second side, the microprocessor first side thermally coupled to the vapor plate second side.
Claims21
A stack up assembly, comprising:
- a voltage regulation module (VRM) circuit board having a first side and a second side;
- a thermally conductive plate having a first side and a second side, wherein the thermally conductive plate first side is thermally coupled to the second side of the VRM circuit board;
- and
- a microprocessor, having a first side and a second side, the microprocessor first side thermally coupled to the vapor plate second side.
Dependencies are inferred from the claim text.