Stacked intelligent power module package

An intelligent power module package comprising:

• a power unit, where a chip used in a power device is bonded to a chip pad of a leadframe having a down-set region and leads formed at both of its sides, and the chip used in a power device is also bonded to each of the leads with wires, a heat sink which is bonded to the back side of the leadframe of a power unit by interposing an insulating layer;
• a control unit, where another leadframe which is different from the above leadframe of the power unit and has leads formed in one direction, is stacked on the leads in one of both sides of the leadframe of the power unit, and is electrically connected to the leadframe of the power unit, and a chip used in a control device is bonded on a chip pad of the leadframe having an up-set region, with wires;
• and
• a sealing material which seals a portion of the leadframe of the power unit, the wire-bonded chip used in a power device, and every side of the heat sink except the bottom side, and also seals a portion of the leadframe of the control unit, and the wire-bonded chip used in a control device.

An intelligent power module package comprising a semiconductor package of a power unit and a semiconductor package of a control unit,

• wherein the semiconductor package of a power unit comprises:
• a leadframe having a a down-set region and leads formed in both of its directions;
• a heat sink which is bonded to the a down-set region of the leadframe by interposing an insulating layer between the heat sink and the bottom side of the leadframe;
• a chip used in a power device which is bonded to a chip pad on the a down-set region of the leadframe;
• wires which connect the chip used in a power device and the leads of the leadframe;
• a sealing material which seals a portion of the leadframe, the chip used in a power device, the wires, and every side of the heat sink except the bottom side, and has a space and a locking means where a semiconductor package of a control unit can be bonded;
• and
• the semiconductor package of a control unit comprises:
• a leadframe having an up-set region and a lead formed in one direction;
• a chip used in a control device which is bonded to a chip pad on the raised region of the leadframe;
• wires which connect the chip used in a power device and the lead of the leadframe;
• a sealing material which seals the chip used in a control device and the wires and has a locking means where the semiconductor package of a power unit can be bonded.