Post-in-crown capacitor and method of manufacture

A method of fabricating a post-in-crown capacitor comprising the steps of:

• forming a conductive via outwardly from a substrate;
• forming a crown coupled to the conductive via;
• forming a post within the crown;
• forming a capacitor insulation layer outwardly from the crown and post;
• and
• forming a capacitor plate layer outwardly from the capacitor insulation layer.

A method of fabricating a post-in-crown capacitor for an electronic device comprising the steps of:

• forming a dielectric layer outwardly from a substrate;
• forming an etch-stop layer outwardly from the dielectric layer;
• forming a first mask outwardly from the dielectric layer that exposes a portion of the etch-stop layer;
• anisotropically etching the exposed portion of the etch-stop layer to expose a portion of the dielectric layer;
• anisotropically etching the exposed portion of the dielectric layer to expose a portion of the substrate;
• removing the first mask to expose the etch-stop layer;
• forming a conductive via layer outwardly from the exposed portion of the substrate and the etch-stop layer;
• removing the conductive via layer formed outwardly from the etch-stop layer, the remaining portion of the conductive via layer forming a conductive via;
• forming a first molding layer outwardly from a etch-stop layer;
• forming a second mask outwardly from the first molding layer that exposes a portion of the first molding layer;
• removing the exposed portion of the first molding layer to expose the conductive via;
• removing the second mask;
• forming a crown layer outwardly from the exposed portion of the conductive via and the first molding layer;
• forming a second molding layer outwardly from the crown layer;
• anisotropically etching the second molding layer to form a core, the core having a center cavity that exposes a portion of the crown layer;
• anisotropically etching the crown layer to form a crown, the crown having a post cavity that exposes a portion of the conductive via;
• forming a post layer outwardly from the exposed portion of the conductive via which fills the post cavity and the center cavity;
• removing a portion of the post layer and the core to expose the second molding layer and form a post;
• removing the core and the first molding layer to expose the dielectric layer, wherein the crown and the post are free-standing;
• forming a capacitor insulation layer outwardly from the crown and post;
• and
• forming a capacitor plate layer outwardly from the capacitor insulation layer.