Ion mill shutter system
AssigneeSeagate Technology LLC
InventorsEdwin Frank Rejda, Joel William Hoehn, Shanlin Hao, Lance Eugene Stover, Todd Arthur Luse, James Richard Peterson
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Abstract
A method for producing magneto resistive heads includes the steps of positioning at least two magneto resistive elements in spaced relation to one another and placing the at least two magneto resistive elements in an ion milling environment where material is removed nonselectively from items in the environment. A property of at least two of the plurality of magneto resistive elements is monitored. In response to monitoring, one of the at least two magneto resistive elements is dynamically covered to prevent additional removal of material from the covered magneto resistive element.
Claims20
A method for producing magneto resistive heads comprising the steps of:
- positioning at least two magneto resistive elements in spaced relation to one another;
- placing the at least two magneto resistive elements in an environment where material is removed nonselectively from items in the environment;
- monitoring a property of at least two of the plurality of magneto resistive elements;
- and
- dynamically covering one of the at least two magneto resistive elements to prevent additional removal of material from the covered magneto resistive element in response to the monitoring step.
An apparatus for use in semiconductor fabrication comprising:
- a carrier;
- an elongated element held by the carrier;
- and
- a dynamic mask that can be used to selectively cover a first portion of the elongated element as the semiconductor process continues to act on a second portion of the elongated element, the semiconductor process substantially halting with respect to the first portion of the elongated element.
An apparatus for use during a semiconductor fabrication process comprising:
- a target;
- means for covering a portion of a target to prevent exposure of the portion of the target from the semiconductor fabrication process while an uncovered portion remains subjected to the semiconductor process.
Dependencies are inferred from the claim text.