Printer, printer head, and method for fabricating printer head
AssigneeSony Corporation
InventorsTakaaki Miyamoto, Toru Tanikawa, Hideki Mori
Life of this patent
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Abstract
A printer and a printer head employing a thermal inkjet method are disclosed. A heater element is arranged so as to overlie a wiring pattern layer carried by a semiconductor substrate, or a wiring pattern portion for power supplying or a wiring pattern portion for grounding, the wiring pattern portions being carried by a semiconductor substrate. This arrangement allows heat generated by the heater element to be efficiently transferred to a liquid ink chamber.
Claims8
A printer that performs printing by heating ink in liquid ink chambers so that ink droplets are ejected from selected ones of orifices, said printer comprising:
- a semiconductor substrate;
- said semiconductor substrate carrying
- heater elements for heating the ink;
- switching transistors for actuating said heater elements;
- driving circuits for driving said switching transistors;
- and
- at least one wiring pattern layer;
- wherein said heater elements overlie said at least one wiring pattern layer.
A printer that performs printing by heating ink in liquid ink chambers so that ink droplets are ejected from selected ones of orifices, said printer comprising:
- a semiconductor substrate;
- said semiconductor substrate carrying
- heater elements for heating the ink;
- switching transistors for actuating said heater elements;
- driving circuits for driving said switching transistors;
- and
- at least one wiring pattern layer, said at least one wiring pattern layer including a wiring pattern portion for power supplying and a wiring pattern portion for grounding,
- wherein said heater elements overlie said wiring pattern portion for power supplying or said wiring pattern portion for grounding.
A printer head that ejects ink droplets from selected ones of orifices by heating ink in liquid ink chambers, said printer head comprising:
- a semiconductor substrate;
- said semiconductor substrate carrying
- heater elements for heating the ink;
- switching transistors for actuating said heater elements;
- driving circuits for driving said switching transistors;
- and
- at least one wiring pattern layer;
- wherein said heater elements overlie said at least one wiring pattern layer.
A printer head that ejects ink droplets from selected ones of orifices by heating ink in liquid ink chambers, said printer head comprising:
- a semiconductor substrate;
- said semiconductor substrate carrying
- heater elements for heating the ink;
- switching transistors for actuating said heater elements;
- driving circuits for driving said switching transistors;
- and
- at least one wiring pattern layer, said at least one wiring pattern layer including a wiring pattern portion for power supplying and a wiring pattern portion for grounding,
- wherein said heater elements overlie said wiring pattern portion for power supplying or said wiring pattern portion for grounding.
A method for fabricating a printer head that has a semiconductor substrate, said semiconductor substrate carrying heater elements, switching transistors for actuating said heater elements, driving circuits for driving said switching transistors, and at least one wiring pattern layer, said method comprising:
- the step of providing said heater elements so that said heater elements overlie said at least one wiring pattern layer.
A method for fabricating a printer head that has a semiconductor substrate, said semiconductor substrate carrying heater elements, switching transistors for actuating said heater elements, driving circuits for driving said switching transistors, and at least one wiring pattern layer including a wiring pattern portion for power supplying and a wiring pattern portion for grounding, said method comprising:
- the step of providing said heater elements so that said heater elements overlie said at least one wiring pattern layer.
Dependencies are inferred from the claim text.