IC card, antenna frame for IC card and method for manufacturing the same
AssigneeShinko Electric Industries Co., Ltd.
InventorsYoshitaka Matsushita, Tsutomu Higuchi
Life of this patent
Estimating the term…
Abstract
An IC card includes an antenna formed as a flat coil wound several times having an inner vacant area, said antenna being made by punching or etching a thin metal strip and having an outermost loop partially connected to and supported by an outer frame of said thin metal strip, and said antenna having respective innermost and outermost terminals. A semiconductor element is electrically connected to said innermost and outermost terminals, respectively. One of said innermost and outermost terminals having an accommodation hole in which said semiconductor element is accommodated. The semiconductor element and the antenna are supported to maintain their form by a supporting material made of biodegradable resin.
Claims16
An IC card comprising:
- a semiconductor element;
- an antenna electrically connected to said semiconductor element;
- and
- a supporting material for supporting said semiconductor element and said antenna, said supporting material being made of biodegradable resin.
A method for manufacturing an IC card comprising the following steps of:
- mounting a semiconductor element on an antenna and electrically connecting said semiconductor element to said antenna;
- and
- supporting said semiconductor element and said antenna by means of a supporting material made of biodegradable resin.
A method for manufacturing an IC card, wherein said antenna is a flat coil wound several times and having an inner vacant area, said method comprising the following steps of:
- mounting a semiconductor element on said flat coil and electrically connecting said semiconductor element to said flat coil;
- arranging a pair of supporting sheets made of biodegradable resin over respective sides of said flat coil and said semiconductor element;
- and
- pressing said pair of supporting sheets toward said flat coil and said semiconductor element.
An antenna frame used for an IC card comprising:
- an antenna formed as a flat coil wound several times having an inner vacant area, said antenna being made by punching or etching a thin metal strip and having an outermost loop partially connected to and supported by an outer frame of said thin metal strip, and said antenna having respective innermost and outermost terminals;
- one of said innermost and outermost terminals having an accommodation hole in which a semiconductor element is to be accommodated;
- and
- supporting material for supporting said antenna to maintain its shape, said supporting material being made of biodegradable resin.
An IC card comprising:
- an antenna formed as a flat coil wound several times having an inner vacant area, said antenna being made by punching or etching a thin metal strip and having an outermost loop partially connected to and supported by an outer frame of said thin metal strip, and said antenna having respective innermost and outermost terminals;
- a semiconductor element electrically connected to said innermost and outermost terminals, respectively;
- one of said innermost and outermost terminals having an accommodation hole in which said semiconductor element is accommodated;
- and
- supporting material for supporting said semiconductor element and said antenna to maintain their form, said supporting material being made of biodegradable resin.
Dependencies are inferred from the claim text.