Local heating of memory modules tested on a multi-motherboard tester
AssigneeKingston Technology Corporation
InventorRamon S. Co
Life of this patent
Estimating the term…
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AssigneeKingston Technology Corporation
InventorRamon S. Co
Estimating the term…
A test system has many motherboards. Each motherboard has a reverse-mounted test adaptor board that contains a test socket. A robotic arm inserts a memory module into the test socket, allowing the motherboard to execute programs to test the memory module. A test chamber surrounds the test socket. Compressed air is regulated and routed to local heaters near each motherboard. The local heaters pass the air over a resistive heating element to heat the air. The heated air is then directed into the test chamber to heat the memory module being tested. A local valve controls the air flow through the local heater. A host computer receives temperature measurements from each test chamber and adjusts the local heater and valve to maintain a desired test temperature. The motherboards can be cooled by cooling fans while the memory modules being tested are heated.
A parallel test system for testing memory modules at a target temperature comprising:
A memory-module tester comprising:
A multiple-motherboard temperature-controlled memory tester comprising:
Dependencies are inferred from the claim text.