Chip socket assembly and chip file assembly for semiconductor chips

A system comprising:

• (a) a circuit board having a surface and having a bus on the surface;
• and
• (b) a base coupled to the surface of the circuit board over the bus, the base having a top and a bottom, the base defining a slot over the bus for receiving at the top of the base an edge of a chip and for guiding the edge of the chip to the bottom of the base and over the bus.

A chip file assembly comprising:

• (a) a base having a top, a bottom, and a plurality of connectors, the base defining a plurality of slots for receiving at the top of the base edges of a plurality of chips and for guiding the edges of the chips to the bottom of the base;
• and
• (b) a plurality of clips configured to mate with the connectors of the base for retaining the chips in the base when mating with the connectors of the base.

A system comprising:

• (a) a circuit board having a surface and having at least one bus on the surface;
• and
• (b) a base coupled to the surface of the circuit board over the at least one bus, the base having a top and a bottom, the base defining a plurality of slots over the at least one bus for receiving at the top of the base edges of a plurality of chips and for guiding the edges of the chips to the bottom of the base and over the at least one bus.

A chip socket assembly comprising:

• a base having a top and a bottom, the base defining a slot for receiving at the top of the base an edge of a chip and for guiding the edge of the chip to the bottom of the base;
• the base having a clip portion configured to mate with the chip for retaining the chip in the base when the chip is placed in the slot of the base.

The chip socket assembly of claim 33, wherein the base defines the slot with a guide for guiding the support pin of the chip when the chip is placed in the slot of the base.

An assembly comprising:

• (a) a vertical chip package that includes a first clip at a first side of the chip package and a second clip at a second side of the chip package;
• (b) a base coupled to a circuit board having a first conductive region, wherein the base secures the vertical chip package by having a first side of the base engage the first clip of the vertical chip package and by having a second side of the base engage the second clip of the vertical chip package wherein a bottom lead of the vertical chip package is electrically coupled to the first conductive region of the circuit board when the base secures the vertical chip package.

A chip package comprising:

• (a) packaging material that contains an integrated circuit, wherein the packaging material has a bottom-facing housing that extends laterally from the packaging material;
• (b) a lead extends from a bottom of the packaging material, wherein the lead has a substantially C-shaped form, wherein an end of the lead resides within the housing when the lead is compressed.

An assembly comprising:

• (a) a vertical chip package that includes cam follower;
• (b) a base coupled to a circuit board having a first conductive region, wherein the base has a slot for receiving the cam follower and for securing the vertical chip package, wherein the slot guides the cam follower in both a downward and a lateral direction, wherein a bottom lead of the vertical chip package is electrically coupled to the first conductive region of the circuit board when the base secures the vertical chip package.

An assembly comprising:

• (a) a horizontal chip package that includes a member on a side of the horizontal chip package;
• (b) a socket for receiving the horizontal chip package, wherein the socket is coupled to a circuit board having a first conductive region, wherein the socket includes a guiding surface for guiding the member of horizontal chip package in an angled downward direction;
• (c) a frame configured to mate with the socket to secure the horizontal chip package in the socket, wherein a lead of the horizontal chip package is electrically coupled to the first conductive region of the circuit board when the frame secures the horizontal chip package in the socket.

A mechanism for securing a horizontal chip package, wherein the mechanism comprises:

• (a) a hinged clamp;
• (b) a lever coupled to the hinged clamp;
• (c) a latch for engaging the lever, wherein when the lever is engaged in the latch, the hinged clamp applies a downward force on a first lead of the horizontal chip package.

A clip for securing a horizontal chip package into a socket, wherein the clip comprises a beam with a downward extending member, wherein a top of the beam engages a tab on the socket, wherein a lower portion of a first end of the beam engages a top of the horizontal chip package, and wherein a bottom of the downward extending member of the beam presses downward on a lead of the horizontal chip package and secures the horizontal chip package in the socket.

An assembly comprising:

• (a) a horizontal chip package;
• (b) a base coupled to a circuit board having a first conductive region, wherein a first side of the base has a tab that juts into an interior of the base;
• (c) a beam that secures the horizontal chip package in the base when (I) a top of the beam engages an underside of the tab of the base and (ii) a bottom of the beam engaged a top of the chip package.