Light source comprising laser diode module
AssigneeFurukawa Electric Co., Ltd.
InventorsShinya Nagamatsu, Kenichi Namba, Shu Namiki
Life of this patent
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Abstract
A light source including at least one laser diode module and a heat pipe having a heat absorbing portion and a heat radiating portion. The laser diode module includes a metal substrate mounting a laser diode chip and an optical component, and a peltier device thermally connected with the metal substrate. The heat absorbing portion of the heat pipe is thermally connected with the peltier device. The light source preferably includes a plurality of densely placed laser diode modules, each of which has an output of at least 100 mW. The light source also preferably includes a plurality of heat pipes having heat radiating fins on the heat radiating portions thereof.
Claims25
A light source comprising a plurality of densely placed laser diode modules, each of said plurality of densely placed laser diode modules having an output of at least 100 mW.
A light source comprising:
- at least one laser diode module including a metal substrate mounting a laser diode chip and an optical component, and a peltier device thermally connected with said metal substrate;
- and
- a heat pipe having a heat absorbing portion and a heat radiating portion, said heat absorbing portion of said heat pipe being thermally connected with said peltier device.
A Raman amplifier comprising a light source including a plurality of densely placed laser diode modules, each of said plurality of densely placed laser diode modules having an output of at least 100 mW.
A Raman amplifier comprising a light source including:
- at least one laser diode module including a metal substrate mounting a laser diode chip and an optical component, and a peltier device thermally connected with said metal substrate;
- and
- a heat pipe having a heat absorbing portion and a heat radiating portion, said heat absorbing portion of said heat pipe being thermally connected with said peltier device.
A light source comprising:
- a laser diode module including a laser diode chip, an optical component, and a peltier device, said laser diode chip and said optical component being supported by said peltier device;
- a mounting portion having said peltier device mounted thereon such that said peltier device is thermally connected with said mounting portion;
- and
- at least one heat pipe having a first portion extending within said mounting portion and a second portion extending from a side of said mounting portion, said heat pipe having an interior with a heat transfer fluid therein.
Dependencies are inferred from the claim text.