Enhanced thermal coupling for electronic boards
OwnerIonel Jitaruinventor
Life of this patent
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Abstract
An improved electronic board assembly in which thermal conductivity is greatly increased through the use of thermally conductive plug placed within the vias. Within a via, usually having its walls coated with copper, a thermally conductive plug (such as copper) is placed; this plug is then secured to the via and the electronic board by flowing and solidifying solder around the plug. Due to the heightened thermal characteristics of the plug, heat is more efficiently wicked away from the electronic elements to a heat sink or heat dissipation mechanism.
Claims27
A thermal via assembly for a primary electronic board comprising:
- a) a via extending through said primary electronic board, walls of said via coated with copper;
- b) a heat conductive plug extending through said via;
- and,
- c) solder connecting said heat conductive plug to the walls of said via.
A thermal conductive channel for a primary electronic board comprising:
- a) a via extending through said primary electronic board;
- b) a heat conductive plug extending through said via;
- and,
- c) solder connecting said heat conductive plug to said via.
An electronic board assembly comprising:
- a) an electronic board adapted to support electronic elements;
- b) an electronic element connected to said electronic board;
- c) a via extending through said electronic board under said electronic element, walls of said via coated with copper;
- d) a heat conductive plug extending through said via;
- and,
- e) solder connecting said heat conductive plug to the walls of said via and to said electronic element.
Dependencies are inferred from the claim text.