Packaged MEMs device and method for making the same
AssigneesAgere Systems Inc., Lucent Technologies Inc.
InventorsDustin W. Carr, Dennis S. Greywall, Sungho Jin, Flavio Pardo, Hyongsok Soh
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AssigneesAgere Systems Inc., Lucent Technologies Inc.
InventorsDustin W. Carr, Dennis S. Greywall, Sungho Jin, Flavio Pardo, Hyongsok Soh
Estimating the term…
A MEMs device comprises a component layer including a frame structure and at least one component movably coupled to the frame and an actuator layer including at least one conductive path and at least one actuator for moving the component. The component layer and the actuator layer are bonded together with solder or other materials in lateral alignment. Advantageously the layers are provided with metallization pads and are bonded together in lateral alignment with predetermined vertical gap spacing by solder bonds between the pads. In a preferred embodiment the MEMs device, however bonded, comprises a component layer, an actuator layer and an intervening spacer. The spacer provides the walls of a cavity between the component and the pertinent actuators to permit movement of the component. The walls cover the bulk of the peripheral boundary of the cavity to provide aerodynamic isolation. Advantageously the walls are conductive to provide electrostatic isolation. The device has particular utility in optical cross connection, variable attenuation and power gain equalization.
A micro-electro-mechanical device comprising:
A method of making an MEMs device comprising a component layer including at least one component movably coupled to the layer and an actuator layer including at least one conductive path and at least one actuator for moving the component, comprising the steps of:
A micro-electro-mechanical (MEMS) device comprising:
A micro-electro-mechanical (MEMs) device comprising:
Dependencies are inferred from the claim text.