Back to results
US 2002/0053872 A1Published application
Light emitting diode and method of making the same
AssigneeUnited Epitaxy Company, Ltd.
InventorsKuang-Neng Yang, Tzer-Perng Chen, Chih-Sung Chang
Life of this patent
Estimating the term…
Abstract
A light emitting diode (LED) and method of making the same are disclosed. The present invention uses a layer of transparent adhesive material to bond a transparent substrate and a LED epitaxial structure having a light-absorbing substrate. The light absorbing substrate is then removed to form a LED having a transparent substrate. By the use of the transparent substrate, the light emitting efficiency of the LED can be significantly improved.
Claims34
A light emitting diode, comprising:
- a LED epitaxial structure having a multi-layered AlGaInP epitaxial structure formed on a light-absorbing substrate;
- a transparent substrate;
- and
- a transparent adhesive material for bonding the transparent substrate and the multi-layered AlGaInP epitaxial structure.
1 more element
A method of making a light emitting diode, comprising:
- providing a LED epitaxial structure having a multi-layered AlGaAs epitaxial structure formed on a light-absorbing substrate;
- providing a transparent substrate;
- and
- using a transparent adhesive material to bond the transparent substrate and the multi-layered AlGaAs epitaxial structure.
1 more element
Dependencies are inferred from the claim text.