IC package and its assembly method

A method of assembling an IC package comprising the steps of:

• forming a substrate having a plurality of through holes each having an insulating film covering one of the openings of each through hole;
• mounting one or more IC chips on a principal surface of the substrate on the insulating film side, and electrically connecting the IC chip and the through holes;
• sealing the substrate with the IC chip mounted thereon with insulating resin;
• and
• cut the substrate with the IC chip mounted thereon to expose the side wall of each through hole.

An IC package comprising:

• a substrate having a concave side;
• an insulating film sealing an opening at the concave side of said substrate;
• IC chip mounted on a side of said substrate, on which said film is arranged;
• a resin sealing said IC chip;
• and
• a rigid member provided on said resin;
• wherein a conductive section formed in the concave side is used as an external connection terminal of the IC chip.

An IC package comprising:

• a substrate having, at a side, a cut through hole filled with a conductive material;
• a photosensor IC chip mounted on one major surface of said substrate;
• a transparent resin sealing said photosensor IC chip;
• and
• a right transmitting member provided on said transparent resin,
• wherein the conductive member at the side of said substrate is used as an external connection terminal of said photosensor IC chip.

A method for producing a photosensor IC package comprising steps of:

• forming a substrate having a through holes of which openings at one side are sealed with an insulating film;
• mounting one or more the photosensor IC chips on a major surface of the substrate, on which the film is arranged;
• providing a light transmitting member through a transparent resin on the substrate on which the photosensor IC chip is mounted;
• and
• cutting the substrate on which the photosensor IC chip is mounted, so that a wall of the through holes are exposed.

A method for producing a photosensor IC chip comprising steps of:

• forming a substrate having plural through holes of which openings are filled with a conductive material;
• mounting on one major surface of the substrate, one or more photosensor IC chips, and connecting electrically the photosensor IC chips with the through holes;
• providing on the substrate on which the photosensor IC chip is mounted, a light transmitting member through a transparent resin;
• and
• cutting the substrate on which the photosensor IC chip is mounted, so that the conductive material in the through hole is exposed.