Structure and package of a heat spreader substrate
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsShin-Hua Chao, Kuan-Neng Liao
Life of this patent
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Abstract
A structure of a heat spreader substrate. A first heat spreader has a first upper surface, a corresponding first lower surface and an opening. A second heat spreader has a second upper surface and a corresponding second lower surface. The second heat spreader is fit tightly into the opening. The second lower surface and the first lower surface are coplanar. A thickness of the second heat spreader is smaller than that of the first heat spreader. A chip is located on the second upper surface. A substrate is located on the first upper surface of the first heat spreader, and the opening is exposed by the substrate.
Claims19
A structure of a heat spreader substrate comprising:
- a first heat spreader having a first upper surface, a first lower surface and an opening;
- a second heat spreader having a second upper surface and a second lower surface, wherein a thickness of the second heat spreader is smaller than a thickness of the first heat spreader, and the second heat spreader is fit tightly into the opening, wherein the second lower surface and the first lower surface are coplanar;
- and
- a substrate located on the first upper surface, wherein the opening of the first heat spreader is exposed.
A package of a semiconductor comprising:
- a first heat spreader having a first upper surface, a corresponding first lower surface and an opening;
- a second heat spreader having a second upper surface and a corresponding second lower surface, wherein a thickness of the second heat spreader is smaller than a thickness of the first heat spreader, and the second heat spreader is fit tightly into the opening, wherein the second lower surface and the first lower surface are coplanar;
- a substrate located on the first upper surface, wherein the opening of the first heat spreader is exposed;
- plurality of mounting pads formed on the substrate;
- a chip having an active surface and a corresponding backside, wherein the backside of the chip is adhered on the second upper surface;
- a plurality of bonding pads formed on the active surface, wherein the bonding pads are electrically connected to the mounting pads;
- and
- a molding compound that encapsulates the chip.
Dependencies are inferred from the claim text.