Solder ball delivery and reflow method
AssigneeKulicke & Soffa Investments, Inc.
InventorsEli Razon, Vaughn Svendsen, Robert Kowtko, Kyle Dury, Krishnan Suresh
Life of this patent
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Abstract
An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.
Claims42
An apparatus for use with an energy source for delivering and reflowing solder material onto a substrate, comprising:
- a first reservoir to hold the solder material;
- a second reservoir;
- a flexible feed tube coupled between the first reservoir and the second reservoir for directing a portion of the solder material from the first reservoir to the second reservoir;
- a capillary for guiding the solder material to the substrate;
- and
- indexing means coupled between the second reservoir and the capillary to individually index the solder material from the second reservoir into the capillary.
An apparatus for use with an energy source for delivering and reflowing solder material onto a substrate, comprising:
- a reservoir to hold the solder material;
- a capillary for guiding the solder material to the substrate;
- a flexible feed tube coupled to the reservoir for directing the solder material from the reservoir to the capillary;
- indexing means coupled between the feed tube and the capillary to individually index the solder material from the feed tube into the capillary;
- and
- delivery means to deliver the solder material from the reservoir, through (a) the feed tube, (b) the indexing means, (c) the capillary and onto the substrate.
A solder delivery and reflow apparatus for use with an energy source for delivering and reflowing solder balls onto a substrate, the apparatus comprising:
- a stationary reservoir containing the solder balls;
- a repositionable reservoir coupled to the fixed reservoir to receive the solder balls;
- a capillary for directing individual solder balls from the repositionable reservoir onto the substrate;
- a feed tube for guiding the solder balls from the repositionable reservoir to the capillary;
- indexing means to individually move solder balls from the feed tube to the capillary;
- delivery means to deliver the solder balls through the feed tube, through the indexing means, through the capillary and onto the substrate at a first location;
- and
- repositioning means to reposition the capillary to a further location on the substrate to deliver another solder ball.
An apparatus for use with an energy source for delivering and reflowing solder material onto a substrate, the apparatus comprising:
- a first reservoir to hold the solder material;
- a second reservoir;
- a flexible feed tube coupled between the first reservoir and the second reservoir for directing a portion of the solder material from the first reservoir to the second reservoir;
- a plurality of capillaries for guiding the solder material to the substrate;
- and
- indexing means coupled between the second reservoir and the plurality of capillaries to individually index ones of the solder material from the second reservoir into respective ones of the plurality of capillaries.
A method of delivering and solder material onto a substrate, the method comprising the steps of:
- (a) agitating the solder material by a pressurized fluid;
- (b) directing the agitated solder material into a column;
- (c) individually indexing the solder material from the column into a capillary;
- and
- (d) directing the individual solder material through the capillary to the substrate.
A method of delivering and solder material onto a substrate, the method comprising the steps of:
- (a) agitating the solder material held in a plurality of reservoirs by a pressurized fluid;
- (b) directing the agitated solder material from the plurality of reservoirs into a respective plurality of columns;
- (c) individually indexing ones of the solder material from the plurality of columns into a respective plurality of capillaries;
- and
- (d) directing the individual ones of the solder material through the plurality of capillaries to the substrate.
Dependencies are inferred from the claim text.