Dicing machine
AssigneeTokyo Seimitsu Co., Ltd.
InventorsOsamu Nishina, Masami Takatori, Yasuyuki Sakaya
Life of this patent
Estimating the term…
Abstract
In the dicing machine, a parallel adjustment process between a cut-line of a blade and cut-line images displayed on a monitor can be easily performed. In the dicing machine, at least one of the first and second cut-line images displayed on the monitor is electronically moved by an image moving device so as to arrange the first and second cut-line images in the same straight line on the monitor. Thus, in the dicing machine of the present invention, the parallel adjustment can be easily performed as compared with the conventional dicing machine in which the parallel adjustment is mechanically performed by moving an imaging device.
Claims3
A dicing machine in which a blade rotates at a high speed so as to cut a semiconductor wafer, comprising:
- a first imaging device and a second imaging device which image a cut-line of the blade on the semiconductor wafer to capture a first cut-line image and a second cut-line image, respectively, the first and second imaging devices being arranged at a predetermined length between each other;
- a monitor which displays the first and second cut-line images side by side;
- and
- an image moving device which electronically moves at least one of the first and second cut-line images on the monitor to align the first and second cut-line images on the monitor.
Dependencies are inferred from the claim text.