Material for copper electroplating, method for manufacturing same and copper electroplating method
AssigneeTsurumi Soda Co., Ltd.
InventorsShiroshi Matsuki, Kazunori Akiyama
Life of this patent
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Abstract
A copper electroplating material capable of exhibiting increased easy-dissolution properties, to thereby minimize formation of an insoluble residue. Basic copper carbonate is formed in a reaction tank by deposition and heated to a temperature of between 250° C. and 800° C. and preferably between 350° C. and 600° C. in an atmosphere which does not form a reducing atmosphere which does not form a reducing atmosphere, to thereby be subjected to thermal decomposition, resulting in providing easily soluble copper oxide. The copper oxide is washed with water and dewatered using, for example, a centrifugal separator. Then, the copper oxide is dried.
Claims13
A method for manufacturing a copper electroplating material adapted to be fed as a copper ion supply to a copper plating bath in copper electroplating, comprising the step of:
- heating basic copper carbonate to a temperature of 250° C. to 800° C. in an atmosphere which is not rendered reductive to carry out thermal decomposition of the basic copper carbonate, to thereby produce easily dissolved copper oxide constituting the copper electroplating material.
A method for manufacturing a copper electroplating material adapted to be fed as a copper ion supply to a copper plating bath in copper electroplating, comprising the step of:
- heating basic copper carbonate to a temperature of 250° C. to 800° C. in an atmosphere which is not rendered reductive to carry out thermal decomposition of the basic copper carbonate, to thereby produce easily dissolved copper oxide;
- and
- washing the easily dissolved copper oxide with water to provide the copper electroplating material.
A copper electroplating material fed as a copper ion supply to a copper plating bath in copper electroplating, comprising easily dissolved copper oxide formed by heating basic copper carbonate to a temperature of 250° C. to 800° C. in an atmosphere which is not rendered reductive to subject it to thermal decomposition.
A copper electroplating material fed as a copper ion supply to a copper plating bath in copper electroplating, comprising easily dissolved copper oxide formed by heating basic copper carbonate to a temperature of 250° C. to 800° C. in an atmosphere which is not rendered reductive to subject it to thermal decomposition, to thereby obtain a thermal decomposition product and then washing the thermal decomposition product with water.
A method for manufacturing a copper electroplating material fed as a copper ion supply to a copper plating bath in copper electroplating, comprising the steps of:
- mixing an aqueous cupric chloride solution and an aqueous solution containing a carbonate ion with each other to prepare a mixed solution;
- keeping the mixed solution at a pH within a range of between 8.0 and 9.0 and a temperature within a range of between 75° C. and 90° C. to form basic copper carbonate;
- and
- subjecting the basic copper carbonate to solid-liquid separation and washing, so that the basic copper carbonate may have a chlorine concentration of 80 ppm or less.
A method for manufacturing a copper electroplating material fed as a copper ion supply to a copper plating bath in copper electroplating, comprising the steps of:
- mixing an aqueous cupric sulfate solution and an aqueous solution containing a carbonate ion with each other to prepare a mixed solution;
- keeping the mixed solution at a pH within a range of between 8.0 and 9.0 and a temperature within a range of between 75° C. and 90° C. to form basic copper carbonate;
- and
- subjecting the basic copper carbonate to solid-liquid separation and washing, so that the basic copper carbonate may have a SO4 concentration of 200 ppm or less.
A method for manufacturing a copper electroplating material fed as a copper ion supply to a copper plating bath in copper electroplating, comprising the steps of:
- feeding an aqueous cupric sulfate solution and an aqueous solution containing a carbonate ion to a reaction tank while adjusting a feed ratio between both aqueous solutions so that a molar ratio of a copper ion to a carbonate ion in a mixed solution of both aqueous solutions may be within a range of between 1:1.3 to 2.6;
- keeping a temperature of the mixed solution at a level of 95° C. or more without pH control of the mixed solution to produce basic copper carbonate;
- and
- subjecting the basic copper carbonate to solid-liquid separation and washing, to thereby provide the copper electroplating material constituted by the basic copper carbonate.
A method for manufacturing basic copper carbonate fed as a copper ion supply to a copper plating bath in copper electroplating, comprising the steps of:
- feeding an aqueous cupric sulfate solution and an aqueous solution containing a carbonate ion to a reaction tank while adjusting a feed ratio between both aqueous solutions so that a molar ratio of a copper ion to carbonate ion in a mixed solution of both aqueous solutions may be within a range of between 1:2.3 to 4.6;
- keeping a temperature of the mixed solution at a level of 95° C. or more without pH control of the mixed solution to produce basic copper carbonate;
- and
- subjecting the basic copper carbonate to solid-liquid separation and washing, to thereby provide the copper electroplating material constituted by the basic copper carbonate.
Dependencies are inferred from the claim text.