Apparatus for improved power coupling through a workpiece in a semiconductor waffer processing system

Apparatus for improved power coupling through a substrate in a processing chamber comprising:

• a pedestal assembly;
• and
• a pedestal cover positioned over the pedestal assembly, the pedestal assembly further comprising:
• a lower shield member;
• an insulating plate member disposed upon the lower shield member;
• a pedestal disposed upon the insulating plate member;
• an insulative isolator ring disposed upon an outer flange portion of the lower shield member such that a lower, horizontal portion of said isolator ring is below and spaced apart from the pedestal;
• a plurality of rest buttons supported in a plurality of hollow portions in the pedestal and passing through a plurality of openings in the pedestal cover.