Printed wiring board and manufacturing method of the printed wiring board
AssigneeSony Corporation
InventorYoshinari Matsuda
Life of this patent
Estimating the term…
Abstract
There is provided a printed wiring board in which control of a characteristic impedance of a signal transmission pattern is realized with a small space and at a low cost, its manufacture is easy, a delay is hard to cause, and a high frequency signal can be stably transmitted. The printed wiring board includes a flat plate base material, a signal transmission pattern provided on at least one surface of the base material, for transmitting a high frequency signal, an insulator layer formed to a constant thickness so as to cover the signal transmission pattern, and a control unit provided on the insulator layer so as to be opposite to the signal transmission pattern and to be grounded, for controlling a characteristic impedance of the signal transmission pattern.
Claims16
A printed wiring board comprising:
- at least one signal transmission pattern with a predetermined width and thickness provided on a surface of a base material, for transmitting a high frequency signal;
- an insulator layer formed to a constant thickness on said surface of said signal transmission pattern for insulating said signal transmission pattern;
- a connection pattern, formed out side of said insulator layer and on said surface of said base material, and connected to a reference voltage;
- and
- a opposing pattern provided on a surface of said insulator layer so as to oppose said signal transmission pattern and to be connected to said connection pattern.
A manufacturing method of a printed wiring board comprising:
- a formation step of a signal transmission pattern for transmitting a high frequency signal and of a connection pattern for connecting to reference voltage on a surface of a base material;
- an insulator layer formation step of providing an insulator layer to a constant thickness on said surface of said signal transmission pattern for insulating said signal transmission pattern;
- and
- a opposing pattern formation step of providing a opposing pattern on a surface of said insulator layer so as to oppose said signal transmission pattern and to be connected to said connection pattern.
Dependencies are inferred from the claim text.