Grounding terminal and mounting structure of the same on a printed circuit board

A structure in which a grounding terminal to contact with a grounding conductor is mounted on a printed circuit board, said grounding terminal comprising:

• a joint part having a plurality of joint surfaces which are to be soldered to a conductive pattern on said printed circuit board;
• a contact part extending from said joint part through a bending area bent in the opposite direction of said joint surfaces, and arranged to contact with said grounding conductor, which is elastically deformed upon being pressed by said grounding conductor;
• at least one of said joint surfaces of said joint part having a smaller surface area than those of the other joint surfaces;
• and
• said grounding terminal being mounted on said printed circuit board by reflow soldering, using the solder having an amount corresponding to the surface area of each of said plurality of joint surfaces.

A method for mounting a grounding terminal to contact with a grounding conductor on a printed circuit board, comprising the steps of:

• forming said grounding terminal which comprises:
• a joint part to be fixed to a conductive pattern on said printed circuit board provided with a joint surface having a relatively large surface area and a joint surface having a relatively small surface area;
• and
• a contact part extending from said joint part through a bending area bent in the opposite direction of said joint surfaces, and arranged to contact with said grounding conductor, which is elastically deformed upon being pressed by said grounding conductor;
• and
• mounting said grounding terminal on said printed circuit board by reflow soldering, using the solder having an amount corresponding to the surface area of each said joint surface.