Electronic component with external connection elements
AssigneeSAS Technologies Co., Ltd.
InventorsUta Gebauer, Volker Strutz
Life of this patent
Estimating the term…
Abstract
The invention relates to an electronic component (1) with external connection elements (2) and to a method of electrically connecting and/or fixing an electronic component (1) and a printed-circuit board (15). For this purpose, the electronic component (1) has capillary elements (6) as external connection elements (2), which are connected to contact connection areas (3) of a leadframe (4) or to contact areas of a chip (5). The capillary element (6) protrudes out of the electronic component (1) and has on its protruding end (7) a suction opening (8) with capillary action.
Claims28
An electronic component (1) with external connection elements (2) which are connected to contact connection areas (3) of a leadframe (4) or to contact areas (31, 32, 33, 34) of a chip (5), at least one external connection element (2) being designed as a capillary element (6) which protrudes out of the electronic component (1) and has at its protruding end (7) a suction opening (8) with capillary action.
The electronic component as claimed in one of the preceding claims, characterized in that the capillary element (6) has two or more vertically arranged contact elements (9).
The electronic component as claimed in one of the preceding claims, characterized in that the electronic component (1) is anchored by means of a solder bridge (16) between the capillary element (6) and a printed-circuit board (15) on the latter and/or is electrically connected to it.
The electronic component as claimed in one of the preceding claims, characterized in that the capillary element (6) has a surface coating to enhance the wetting properties with respect to molten solder.
The electronic component as claimed in one of the preceding claims, characterized in that the capillary element (6) is coated with a nickel-gold alloy.
The electronic component as claimed in one of the preceding claims, characterized in that the suction opening (8) with capillary action has an opening width of between 50 μm and 500 μm.
A method of electrically connecting and/or fixing an electronic component (1) and a printed-circuit board (15) which has the following method steps:
- providing the electronic component (1) with at least one capillary element (6), which has a suction opening (8) with capillary action and protrudes out of the electronic component (1),
- selectively coating a printed-circuit board (15) with a wetting material on predetermined areas (17),
- heating the wetting material to its melting temperature,
- positioning and aligning at least one electronic component (1) on the underside (24) of the printed-circuit board (15), while
- immersing the capillary element (6) in the molten material,
- forming an extensive contact in the capillary element (6) and on the printed-circuit board (15) while simultaneously solidifying the material.
Dependencies are inferred from the claim text.