Printed-Circuit board and a semiconductor module, and a manufacturing process of the semiconductor module
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorMasaaki Kusui
Life of this patent
Estimating the term…
Abstract
A printed-circuit board of the present invention, comprises a circuit substrate 1; a plurality of patterned wires 3 formed on a surface of said circuit substrate 1; a plurality of lands 2, each land 2 connected to at least one of said patterned wires 3 through an end portion 3a thereof; and a protection layer 6 with a plurality of openings 7, covering the surface of said circuit substrate 1, wherein said land 2 and said end portion 3a connected thereto are exposed in the associated opening 7 of said protection layer 6.
Claims7
A printed-circuit board, comprising:
- a circuit substrate;
- a plurality of patterned wires formed on a surface of said circuit substrate;
- a plurality of lands, each land connected to at least one of said patterned wires through an end portion thereof;
- and
- a protection layer with a plurality of openings, covering the surface of said circuit substrate, wherein said land and said end portion connected thereto are exposed in the associated opening of said protection layer.
A semiconductor module, comprising:
- a printed-circuit board, including a circuit substrate, a plurality of patterned wires formed on a surface of said circuit substrate, a plurality of lands, each land connected to at least one of said patterned wires through an end portion thereof;
- a semiconductor integrated circuit having a plurality of pins;
- and
- a plurality of ball-like solders formed on each of said pins to mount said semiconductor integrated circuit upon said printed-circuit board such that each of said ball-like solders is fused onto one of said lands and on the end portion of said patterned wires connected thereto.
A process for manufacturing a semiconductor module, comprising steps of:
- covering an entire surface of a circuit substrate with a protection layer, wherein a plurality of patterned wires and lands are formed on said circuit substrate such that each of said patterned wires are connected at least one of said lands through an end portion thereof;
- opening a plurality of openings within said protection layer, each of said lands and end portions being exposed therethrough;
- aligning and connecting ball-like solders of a semiconductor integrated circuit to said lands;
- fusing said ball-like solders onto said lands and end portions of said patterned wires connected thereto, by heating the semiconductor module;
- and
- inspecting a shape of soldering by fluoroscoping the semiconductor module with a X-rays.
Dependencies are inferred from the claim text.