Automatic separator and method to obtain circuits for microelectronics
AssigneeBaccini Srl
InventorBaccini Gisulfo
Life of this patent
Estimating the term…
Abstract
Automatic separator to separate the supporting sub-layer from the print support in work elements for microelectronics and method to realize such separation. The automatic separator comprises a pick up plate provided with depression-type elements for picking up the print support. The pick up plate is movable from a first position in which each print support is stored together with the associated supporting sub-layer to a second position wherein each print support is positioned without the associated supporting sub-layer for a subsequent manufacturing phase. The pick up plate during its movement bring the supporting sub-layer in contact with stationary detachment elements which cause the separation of the supporting sub-layer from the related print support.
Claims17
A device to separate a print support, usable in microelectronics or for manufacturing multi-layer electronic circuits, from its associated supporting sub-layer, wherein said print support and the associated supporting sub-layer form a work element and wherein said print support is able to be moved from a first position in which it is stored together with the associated supporting sub-layer to a second position wherein it is positioned without the associated supporting sub-layer for a subsequent manufacturing phase, said device comprising pick up means having depression-type means for selectively picking up said print support in said first position, wherein moving means are provided for moving said pick up means from said first position to said second position along a defined path, and wherein detachment means are disposed along said defined path, in an intermediate position between said first position and said second position for contacting said supporting sub-layer and causing the removing thereof from said print support during the movement of said pick up from said first position to said second position.
Method to separate a print support, usable in microelectronics or for manufacturing multi-layer electronic circuits, from its associated supporting sub-layer, wherein said print support and the associated supporting sub-layer form a work element, wherein said print support is movable from a first position in which it is stored together with the associated supporting sub-layer to a second position wherein it is positioned without the associated supporting sub-layer for a subsequent manufacturing phase, wherein pick up means having depression-type means are provided for selectively picking up said print support in said first position, wherein said pick up means are moved by moving means from said first position to said second position along a defined path, and wherein said sub-layer is brought into contact with detachment means disposed along said defined path, in an intermediate position between said first position and said second position, for causing the removing of said sub-layer from said print support during the movement of said pick up from said first position to said second position.
Dependencies are inferred from the claim text.