Epoxy resin composition for encapsulating semiconductor, and resin-encapsulated type semiconductor apparatus

An epoxy resin composition for encapsulating semiconductor comprising:

• (A) an epoxy resin having two or more epoxy groups in a molecule represented by formula (1),
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• in the formula, n is an average number of the repeating units, and represents a numerical value of 1 to 20;
• R1, R2, R3, and R4 independently represent, hydrogen atom, an alkyl group having 1-8 carbon atoms, a cycloalkyl group having 5-12 carbon atoms, an aryl group having 6-12 carbon atoms, or an aralkyl group having 7-20 carbon atoms;
• P and Q independently represent, halogen atom, an alkyl group having 1-8 carbon atoms, an alkenyl grouphaving 1-8 carbonatoms, analkynylgrouphaving 1-8 carbon atoms, a cycloalkyl group having 5-12 carbon atoms, an aryl group having 6-14 carbon atoms, an aralkyl group having 7-20 carbon atoms, an alkoxy group having 1-8 carbon atoms, an alkenyloxy group having 1-8 carbon atoms, an alkynyloxy group having 1-8 carbon atoms, an aryloxy group having 6-14 carbon atoms, nitro group or cyano group;
• when n is 1, i is an integer of 0 to 4, and when n is not 1, i is an integer of 0 to 3;
• j is an integer of 0 to 4;
• all of R1, R2, R3, and R4 are not hydrogen atoms at the same time,
• (B) a curing agent having a phenolic hydroxyl group, and
• (C) inorganic filler in an amount of 60 to 98% by weight based on the whole composition.