Transfer apparatus for semiconductor process

A transfer apparatus for transferring a target substrate in a semiconductor processing system, the semiconductor processing system including an airtight process chamber for processing the substrate and an airtight transfer chamber connected to the process chamber through a gate, the transfer apparatus comprising:

• a transfer member provided in the transfer chamber in order to transfer the substrate between the transfer chamber and the process chamber, the transfer member including a mount portion on which the substrate is placed;
• a driving section configured to drive the transfer member in order to transfer the substrate;
• first and second reference portions which are visible optically and provided adjacent to the mount portion, the first and second reference portions moving integratedly with the mount portion when the transfer member transfers the substrate;
• a storage section configured to store first and second reference values representing distances between the substrate located at a normal position on the mount portion and the first and second reference portions;
• a detecting section for optically detecting first and second distances between the substrate and the first and second reference portions when the transfer member transfers the substrate;
• a calculating section configured to calculate the amount of positional shift of the substrate from the normal position based on the first and second reference values and the first and second distances;
• and
• a control section configured to control the driving section in consideration of the amount of positional shift of the substrate calculated by the calculating section when the transfer member transfers the substrate to the process chamber.

A method of transferring a target substrate in a semiconductor processing system, comprising the steps of:

• preparing a transfer apparatus, wherein the transfer apparatus comprises a transfer member including a mount portion on which the substrate is placed, a driving section configured to drive the transfer member in order to transfer the substrate, and first and second reference portions provided adjacent to the mount portion, the first and second reference portions moving integratedly with the mount portion when the transfer member transfers the substrate;
• storing first and second reference values representing distances between the substrate located at a normal position on the mount portion and the first and second reference portions;
• detecting first and second distances between the substrate and the first and second reference portions when the transfer member transfers the substrate;
• calculating the amount of positional shift of the substrate from the normal position based on the first and second reference values and the first and second distances;
• and
• controlling the driving section such that the transfer member transfers the substrate in consideration of the calculated amount of positional shift of the substrate.