Workpiece enclosure and processing system

A workpiece enclosure system for use with robotic workstations configured to perform laser operations on workpieces, the workpiece enclosure system comprising:

• first and second light-tight pass-through enclosures;
• a laser workstation cell having a plurality of headstock/tailstock positioners and in communication with the first and second light-tight pass-through enclosures;
• and
• a first materials handling robot arranged to move the workpieces from the first light-tight pass-through enclosure to one of the plurality of headstock/tailstock positioners, and arranged to move the workpieces from the headstock/tailstock positioners to the second pass-through enclosure.

A laser-cutting system including a workpiece enclosure system comprising:

• a workpiece loading section;
• a laser workstation cell having a plurality of robotic laser-cutters;
• a workpiece unloading section;
• a first materials handling robot arranged to move workpieces from an input conveyor to a first light-tight pass-through enclosure in communication with the laser workstation cell, wherein the laser workstation cell includes a second materials handling robot arranged to move workpieces from the pass-through enclosure to one of two dual headstock/tailstock positioners for laser cutting by the plurality of robotic laser-cutters, and the second materials handling robot is further arranged to move workpieces from the headstock/tailstock positioners to a second pass-through enclosure in communication with the workpiece unloading section;
• and a third materials handling robot arranged to move workpieces from the second pass-through enclosure to an output conveyor.