Aqueous solutions containing dithionic acid and/or metal dithionate
OwnerMichael D. Gernon, Sandra L. Bodarinventors
Life of this patent
Estimating the term…
Abstract
This invention relates to solutions of dithionic acid and/or dithionate salts for use in metal finishing processes such as those used for the cleaning, activating, electroplating, electroless plating, conversion coating and/or other pre-treatment or post-treatment of a metallic surface. In particular the solutions are a useful electrolyte for the electroplating of metallic coatings, especially, Sn, Cu, Ni, Zn and precious metals, onto metal or plastic substrates and/or other surfaces.
Claims14
A metal finishing solution composition which contains free dithionic acid.
An electroplating solution composition which contains free dithionic acid.
An electroplating solution composition which contains metal or ammonium dithionate salts.
A surface cleaning or activating solution composition which contains free dithionic acid.
A surface cleaning solution composition for a substrate, other than copper, which contains metal or ammonium dithionate salts.
An electroless or immersion plating composition which contains free dithionic acid.
An electroless or immersion plating composition, other than one for nickel or palladium, which contains dissolved metal or ammonium dithionate salts.
An electroless or immersion plating composition for nickel or palladium which contains dissolved metal or ammonium dithionate salts at concentrations greater than 0.1 M in metal.
Dependencies are inferred from the claim text.