Projected gimbal point drive
AssigneeLam Research Corporation
InventorDavid G. Halley
Life of this patent
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Abstract
A projected gimbal point drive system is disclosed. The projected gimbal point drive system includes a spindle capable of apply a torque, and having a concave spherical surface formed on its lower portion. Further included is a wafer carrier disposed partially within the lower portion of the spindle. The wafer carrier has a convex spherical surface formed on a surface opposite the concave spherical surface of the spindle. In addition, a drive cup is included that is disposed between the spindle and the wafer carrier. The drive cup has a concave inner surface and a convex outer surface, and allows the wafer carrier to be tilted about a predefined gimbal point. In this manner, torque can be applied without affecting the gimbal action.
Claims22
A projected gimbal point drive system, comprising:
- a spindle capable of applying a torque, the spindle having a concave spherical surface formed on a lower portion of the spindle;
- a wafer carrier disposed partially within the lower portion of the spindle, the wafer carrier having a convex spherical surface formed on a surface opposite the concave spherical surface of the spindle;
- and
- a drive cup disposed between the spindle and the wafer carrier, the drive cup having a concave inner surface and a convex outer surface, wherein the drive cup allows the wafer carrier to be tilted about a predefined gimbal point.
A projected gimbal point drive cup, comprising:
- a first set of elongated slots located in a convex outer surface of the drive cup;
- and
- a second set of elongated slots located in a concave inner surface of the drive cup, wherein the drive cup allows a wafer carrier to be tilted about a predefined gimbal point.
A method for driving a projected gimbal point system, comprising the operations of:
- providing a spindle capable of applying a torque, the spindle having a concave spherical surface formed on a lower portion of the spindle;
- disposing a wafer carrier partially within the lower portion of the spindle, the wafer carrier having a convex spherical surface formed on a surface opposite the concave spherical surface of the spindle;
- and
- coupling the spindle to the wafer carrier using a drive cup disposed between the spindle and the wafer carrier, the drive cup having a concave inner surface and a convex outer surface, wherein the drive cup allows the wafer carrier to be tilted about a predefined gimbal point.
Dependencies are inferred from the claim text.