Polishing method and polishing apparatus
AssigneeEbara Corporation
InventorsHiroomi Torii, Hiroshi Kojima, Suguru Ogura, Soichi Isobe
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AssigneeEbara Corporation
InventorsHiroomi Torii, Hiroshi Kojima, Suguru Ogura, Soichi Isobe
Estimating the term…
The present invention relates to a polishing method and apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. A polishing liquid Q is supplied onto a polishing cloth 11 attached on a turntable 1, and a semiconductor wafer W to be polished is held by a top ring 2. The turntable 1 and the top ring 2 are rotated, respectively. A surface, to be polished, of the semiconductor wafer W held by the top ring 2 is pressed against the polishing cloth 11 on the turntable 1 to polish the semiconductor wafer W. When the polished semiconductor wafer W held by said top ring 2 is to be removed from the polishing cloth 11 on the turntable 1, a relative speed of the turntable 1 and the top ring 2 is increased in comparison with a relative speed of the turntable 1 and the top ring 2 at a period of polishing.
A polishing method comprising:
A polishing apparatus for polishing a workpiece to be polished, comprising:
A polishing apparatus for polishing a workpiece to be polished, comprising:
A polishing method comprising:
Dependencies are inferred from the claim text.