Eliminating air pockets under a polishing pad
AssigneeRodel Holdings, Inc.
InventorsStanley E. Eppert JR., Adam Manzonie, Peter W. Freeman, Elizabeth A. Langlois
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Abstract
A polishing pad assembly is provided that is useful for the chemical mechanical polishing of glass and electrical devices such as semiconductor wafers that comprises a polish pad and a semi-rigid base material firmly adhered to the polishing pad for positioning on a polishing platen of a polishing machine; wherein the semi-rigid base material has a modulus of rigidity of 0.01-50 GPa (GigaPascals) determined according to ASTM D 790, a thickness of 0.25-15.0 mm, and a grooved surface having a pitch of 5-100 mm and the grooves have a width of 0.025-2.5 mm and a depth of 0.1-2.5 mm.
Claims10
A polishing pad assembly useful for the chemical mechanical polishing of glass and electrical devices comprising a polish pad and a semi-rigid base material firmly adhered to the polishing pad for positioning on a polishing platen of a polishing machine;
- wherein the semi-rigid base material has a modulus of rigidity of 0.01-50 GigaPascals determined according to ASTM D 790, a thickness of 0.25-15.0 mm, and a grooved surface being in contact with the polishing pad having a pitch of 5-100 mm and the grooves having a width of 0.025-2.5 mm and a depth of 0.1-2.5 mm.
A polishing assembly useful for the chemical mechanical polishing of glass and electrical devices comprising a polish pad and a backing pad firmly adhered to the polishing pad and a polishing platen having a grooved surface of a polishing machine;
- wherein said polishing pad and backing pad are positioned on the grooved surface of the polishing platen and the backing pad being firmly adhered to the platen.
Dependencies are inferred from the claim text.