Method and apparatus for wireless transfer of chemical-mechanical planarization measurements

An apparatus for transmitting wireless signals from a planarizing device, the planarizing device having a support, a platen, and a carrier movable relative to the support and the platen to planarize a semiconductor substrate engaged by the carrier as the carrier moves relative to the platen, the apparatus comprising:

• a sensor coupled to one of the platen, the carrier and the semiconductor substrate to generate a sensor signal corresponding to a value of a selected property of one of the planarizing device and the semiconductor substrate;
• a wireless transmitter coupled to the sensor to receive the sensor signal and transmit a wireless transmitter signal corresponding to the sensor signal;
• and
• a wireless receiver spaced apart from the wireless transmitter to receive the transmitter signal, the wireless receiver being generally fixed relative to the support.

An apparatus for detecting removal of material from a substrate, the substrate having a first surface and a second surface opposite the first surface, the substrate being light transmissive from the first surface to a point proximate the second surface, the second surface having a reflective layer attached thereto, the device comprising:

• a platen having a planarizing surface;
• a carrier having a first surface and a second surface opposite the first surface, the second surface of the carrier being configured to receive the substrate and engage the substrate with the planarizing surface of the platen, the carrier and substrate being movable relative to the platen when the substrate is engaged with the planarizing surface to remove the reflective layer from the substrate;
• a light source positioned proximate to the first surface of the substrate to irradiate the first surface;
• and
• a light sensor positioned proximate to the first surface of the substrate to detect light reflected from the reflective layer of the substrate through the first surface of the substrate.

A method for transmitting data from a planarizing device having a first portion and a second portion movable relative to the first portion to planarize a substrate positioned therebetween, the method comprising:

• measuring a value of a selected property of one of the planarizing device and the substrate;
• generating a sensor signal corresponding to the measured value;
• and
• transmitting the sensor signal from the second portion of the planarizing device with a wireless communication link.

A method for transmitting data from a planarizing apparatus having a first portion and a second portion movable relative to the first portion to planarize a semiconductor substrate positioned between the first and second portions, the method comprising:

• measuring a value of a selected property of one of the planarizing apparatus and the semiconductor substrate and generating a sensor signal corresponding to the value of the selected property;
• storing the sensor signal in a memory device of the planarizing apparatus;
• and
• transmitting the sensor signal from the memory device.

A method for detecting removal of material from a substrate, the substrate having a first surface and a second surface opposite the first surface, the substrate being light transmissive from the first surface to a point proximate to the second surface, the second surface having a reflective layer attached thereto, the method comprising:

• removing at least a portion of the reflective layer;
• directing light through the first surface of the substrate and toward the reflective layer with a light source;
• and
• detecting light reflected by the reflective layer through the first surface of the substrate.